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White Coverlay
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DCWB
- Application Scenario: Light strip/backlight
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
Black Coverlay
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DCIB/DCBB
- Application Scenario: Electronic/Camera
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
Normal Coverlay
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DCIB
- Application Scenario: Car/Medical/Electronic
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
Solvent based Bonding Sheet
- Adhesive Type: Modified solvent based Acrylic resin
- Dongyi Model: PH
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
Acrylic resin based Bonding Sheet
- Adhesive Type: Modified Acrylic resin
- Dongyi Model: P
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
Epoxy resin based Bonding Sheet
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: PE
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet/Multi-layer board
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
Low Dk/Df Bonding Sheet
- Adhesive Type: Modified Polyimide resin
- Dongyi Model: PL
- Application Scenario: FPC补强/PI/FR4/钢片
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
Low Dk/Df Bonding Sheet
- Adhesive Type: Modified Polyimide resin
- Dongyi Model: PL
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
High Thermal Conductivity Bonding Sheet
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: PS
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet/Multi-layer board
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
