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- Mobile Equipment Intelligent Wearing Backlight & Home Appliances Packaging Materials Chip Process Materials Optical Device Packaging
- Packaging Materials Solution
- Water oxygen barrier is a new flexible packaging material for OLED, mainly used to isolate oxygen, water, impurities, etc., thereby protecting the electrode material and luminescent material of OLED. (If you have a more detailed understanding of our product solutions, please contact our website's contact information or scan our QR code or leave a message.)
- Product List:
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UV Initiation Adhesive
- Adhesive Type: Modified Acrylic resin
- Dongyi Model: DLEUV
- Application Scenario: Used for glass cutting, wafer cutting, and lens chip cutting protection, it has extremely high initial bonding strength and instantly loses adhesion after UV irradiation, making it easy to peel off.
- Introduction: Used for glass cutting, wafer cutting, and lens chip cutting protection, it has extremely high initial bonding strength and instantly loses adhesion after UV irradiation, making it easy to peel off.
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Optical Clear Adhesive (OCA) - Soft Type
- Adhesive Type: Modified Acrylic resin
- Dongyi Model: DORA
- Application Scenario: Used for the manufacturing and bonding of capacitive touch screens, it has excellent optical characteristics, excellent reworkability, and segment filling performance.
- Introduction: Used for the manufacturing and bonding of capacitive touch screens, it has excellent optical characteristics, excellent reworkability, and segment filling performance.
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Optical Clear Adhesive (OCA) - Rigid Type
- Adhesive Type: Modified Acrylic resin
- Dongyi Model: DORS
- Application Scenario: Used for the manufacturing and bonding of capacitive touch screens, it has excellent optical characteristics, excellent reworkability, and segment filling performance.
- Introduction: Used for the manufacturing and bonding of capacitive touch screens, it has excellent optical characteristics, excellent reworkability, and segment filling performance.
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AB Double-sided tape
- Adhesive Type: Modified Acrylic resin
- Dongyi Model: DUAD
- Application Scenario: Used for touch screen tempered film, backlight, LCD display screen, flexible circuit board, label, photovoltaic and other fields.
- Introduction: Used for touch screen tempered film, backlight, LCD display screen, flexible circuit board, label, photovoltaic and other fields.
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Thermal Initiation Adhesive
- Adhesive Type: Modified Acrylic resin
- Dongyi Model: DLEH
- Application Scenario: Used for protecting grinding processes such as ceramics, peeling, and wafers.
- Introduction: Used for protecting grinding processes such as ceramics, peeling, and wafers.
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COG/COB Encapsulation Film
- Adhesive Type: Modified Acrylic resin
- Dongyi Model: DOEA
- Application Scenario: Used for front packaging of COG/COB Display Mini LED projects.
- Introduction: Used for front packaging of COG/COB Display Mini LED projects.
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South China Headquarters
GUANGDONG DONGYI HIGH -TECH MATERIAL SCIENCE&TECHNOLOGY CO., LTD.
[Factory 1] No. 22 Changsheng Road, South District, Zhongshan City, Guangdong Province
[Factory 2] No.1 Zhichuang Road, Banfu Town, Zhongshan City, Guangdong Province
Phone: 0760-88892634 0760-88895714
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East China Branch
JIANGSU JUTEK ADVANCED MATERIAL SCIENCE & TECHNOLOGY CO., LTD.(Be wholly-owned subsidiary by Guangdong Dongyi)
Address: Building 3, No. 255 Renmin Middle Road, Chongchuan District, Nantong City, Jiangsu Province
Phone: 0513-80979666
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