OMR Protective Film
    OMR Protective Film
  • Adhesive Type: Modified Polyurethane resin
  • Dongyi Model: DLEA
  • Application Scenario: It is mainly used in automotive interiors, consumer electronics, and home appliance casings.
  • Introduction: It is mainly used in automotive interiors, consumer electronics, and home appliance casings.
Anti-Shattering Film(ASF) for Portable Devices
    Anti-Shattering Film(ASF) for Portable Devices
  • Adhesive Type: Modified Silicone resin
  • Dongyi Model: DIEA
  • Application Scenario: When applied to the CF texture color design of mobile phone back covers,home appliances,and otherproducts,it exhibits excellent optical performance and printability.
  • Introduction: When applied to the CF texture color design of mobile phone back covers,home appliances,and otherproducts,it exhibits excellent optical performance and printability.
Ultra-Low Peel-off Voltage Protective Film
    Ultra-Low Peel-off Voltage Protective Film
  • Adhesive Type: Modified Polyurethane resin
  • Dongyi Model: DLEA
  • Application Scenario: It is applied to consumer electronics screens and touch devices, flat-panel displays and optical components, as well as other precision electronic parts, providing them with process protection and shipment protection.
  • Introduction: It is applied to consumer electronics screens and touch devices, flat-panel displays and optical components, as well as other precision electronic parts, providing them with process protection and shipment protection.
POFilm Based UV Initiation Adhesive
    POFilm Based UV Initiation Adhesive
  • Adhesive Type: Modified Acrylic resin
  • Dongyi Model: DLPUV
  • Application Scenario: It is mainly used in the electronic manufacturing field such as chip and semiconductor manufacturing, display manufacturing, and electronic component assembly, for protecting and foxing precision components.
  • Introduction: It is mainly used in the electronic manufacturing field such as chip and semiconductor manufacturing, display manufacturing, and electronic component assembly, for protecting and foxing precision components.
Low Dk/Df FCCL
    Low Dk/Df FCCL
  • Adhesive Type:
  • Dongyi Model: DDIL/DSIL
  • Application Scenario: Car/Medical/Electronic
  • Introduction: Low Dk/Df FCCL With advantages such as low surface roughness, low signal loss, and good thermal stability.
Halogen-free Black PI Based FCCL Film
    Halogen-free Black PI Based FCCL Film
  • Adhesive Type:
  • Dongyi Model: DSBF
  • Application Scenario: Car/Medical/Electronic
  • Introduction:
Halogen-free PI Based FCCL(Single-Sided&Double-sided)
    Halogen-free PI Based FCCL(Single-Sided&Double-sided)
  • Adhesive Type:
  • Dongyi Model: DDIF/DSIF
  • Application Scenario: Car/Medical/Electronic
  • Introduction: The product is mainly used as a base material for circuitry buildinafor products such as consumerelectronics,industrialinstruments,communication equipments,and etc.
Halogen Free PI Stiffener
    Halogen Free PI Stiffener
  • Adhesive Type:
  • Dongyi Model: DTIX/DTIA/DTIB
  • Application Scenario: Car/Medical/Electronic
  • Introduction: The product is mainly used to reinforce parts such as gold finger.
Bonding Sheet with Thermal Conductivity
    Bonding Sheet with Thermal Conductivity
  • Adhesive Type:
  • Dongyi Model: PS-S
  • Application Scenario: Mainly used in electronic/industrial scenarios that require high-efficiency thermal conductivity and close-fitting sealing, such as heat-dissipating aluminum substrates and LED lighting.
  • Introduction: Mainly used in electronic/industrial scenarios that require high-efficiency thermal conductivity and close-fitting sealing, such as heat-dissipating aluminum substrates and LED lighting.