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    • (If you have a more detailed understanding of our product solutions, please contact our website's contact information or scan our website's QR code and leave a message.)
    • Product List:
    • Acrylic resin based Bonding Sheet
        Acrylic resin based Bonding Sheet
      • Adhesive Type: Modified Acrylic resin
      • Dongyi Model: P
      • Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
      • Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
      Epoxy resin based Bonding Sheet
        Epoxy resin based Bonding Sheet
      • Adhesive Type: Modified Epoxy resin
      • Dongyi Model: PE
      • Application Scenario: FPC Stiffener/PI/FR4/Steel sheet/Multi-layer board
      • Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
      Solvent based Bonding Sheet
        Solvent based Bonding Sheet
      • Adhesive Type: Modified solvent based Acrylic resin
      • Dongyi Model: PH
      • Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
      • Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
      Low Dk/Df Bonding Sheet
        Low Dk/Df Bonding Sheet
      • Adhesive Type: Modified Polyimide resin
      • Dongyi Model: PL
      • Application Scenario: FPC补强/PI/FR4/钢片
      • Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
      High Thermal Conductivity Bonding Sheet
        High Thermal Conductivity Bonding Sheet
      • Adhesive Type: Modified Epoxy resin
      • Dongyi Model: PS
      • Application Scenario: FPC Stiffener/PI/FR4/Steel sheet/Multi-layer board
      • Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
      Normal Coverlay
        Normal Coverlay
      • Adhesive Type: Modified Epoxy resin
      • Dongyi Model: DCIB
      • Application Scenario: Car/Medical/Electronic
      • Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
      Black Coverlay
        Black Coverlay
      • Adhesive Type: Modified Epoxy resin
      • Dongyi Model: DCIB/DCBB
      • Application Scenario: Electronic/Camera
      • Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
      White Coverlay
        White Coverlay
      • Adhesive Type: Modified Epoxy resin
      • Dongyi Model: DCWB
      • Application Scenario: Light strip/backlight
      • Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
      Low Dk/Df Coverlay
        Low Dk/Df Coverlay
      • Adhesive Type: Modified Polyimide resin
      • Dongyi Model: DCIL
      • Application Scenario: Car/Medical/Electronic
      • Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
      High Thermal Conductivity Coverlay
        High Thermal Conductivity Coverlay
      • Adhesive Type: Modified Epoxy resin
      • Dongyi Model: DCIS
      • Application Scenario: Car/Medical/Electronic
      • Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
      PI Stiffener without outer layer adhesive
        PI Stiffener without outer layer adhesive
      • Adhesive Type: Inner Layer:Modified Epoxy resin
      • Dongyi Model: DTIX
      • Application Scenario: FPC Stiffener
      • Introduction: Used for enhancing the insertion and removal of gold fingers and other parts in flexible circuit boards.
      PI Stiffener with  outer layer adhesive
        PI Stiffener with outer layer adhesive
      • Adhesive Type: Inner Layer:Modified Epoxy resin + Outer Layer: Modified Acrylic resin
      • Dongyi Model: DTIA
      • Application Scenario: FPC Stiffener
      • Introduction: Used for enhancing the insertion and removal of gold fingers and other parts in flexible circuit boards.
      Single/Double sided ED CU based FCCL
        Single/Double sided ED CU based FCCL
      • Adhesive Type: Modified Epoxy resin
      • Dongyi Model: DSIF/DSEB/DDIF
      • Application Scenario: Car/Medical/Electronic
      • Introduction: Single panel: mainly used for laptop monitors, mobile phone antenna boards, etc Double sided panel: mainly used for electronic industry instruments, communication equipment, etc
      Single/Double sided RA CU based FCCL
        Single/Double sided RA CU based FCCL
      • Adhesive Type: Modified Epoxy resin
      • Dongyi Model: DSIF/DSEB/DDIF
      • Application Scenario: Car/Medical/Electronic
      • Introduction: Single panel: mainly used for laptop monitors, mobile phone antenna boards, etc Double sided panel: mainly used for electronic industry instruments, communication equipment, etc
    • South China Headquarters

      GUANGDONG DONGYI HIGH -TECH MATERIAL SCIENCE&TECHNOLOGY CO., LTD.

      [Factory 1] No. 22 Changsheng Road, South District, Zhongshan City, Guangdong Province

      [Factory 2] No.1 Zhichuang Road, Banfu Town, Zhongshan City, Guangdong Province

      Phone: 0760-88892634 0760-88895714

    • East China Branch

      JIANGSU JUTEK ADVANCED MATERIAL SCIENCE & TECHNOLOGY CO., LTD.(Be wholly-owned subsidiary by Guangdong Dongyi)

      Address: Building 3, No. 255 Renmin Middle Road, Chongchuan District, Nantong City, Jiangsu Province

      Phone: 0513-80979666

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