Single/Double sided RA CU based FCCL
    Single/Double sided RA CU based FCCL
  • Adhesive Type: Modified Epoxy resin
  • Dongyi Model: DSIF/DSEB/DDIF
  • Application Scenario: Car/Medical/Electronic
  • Introduction: Single panel: mainly used for laptop monitors, mobile phone antenna boards, etc. Double panel: mainly used for electronic industrial instruments, communication equipment, etc.
 Single/Double sided RA CU based FCCL
    Single/Double sided RA CU based FCCL
  • Adhesive Type: Modified Epoxy resin
  • Dongyi Model: DSIF/DSEB/DDIF
  • Application Scenario: Car/Medical/Electronic
  • Introduction: Single panel: mainly used for laptop monitors, mobile phone antenna boards, etc Double sided panel: mainly used for electronic industry instruments, communication equipment, etc
 Single/Double sided ED CU based FCCL
    Single/Double sided ED CU based FCCL
  • Adhesive Type: Modified Epoxy resin
  • Dongyi Model: DSIF/DSEB/DDIF
  • Application Scenario: Car/Medical/Electronic
  • Introduction: Single panel: mainly used for laptop monitors, mobile phone antenna boards, etc. ​Double panel: mainly used for electronic industrial instruments, communication equipment, etc.
 Single/Double sided ED CU based FCCL
    Single/Double sided ED CU based FCCL
  • Adhesive Type: Modified Epoxy resin
  • Dongyi Model: DSIF/DSEB/DDIF
  • Application Scenario: Car/Medical/Electronic
  • Introduction: Single panel: mainly used for laptop monitors, mobile phone antenna boards, etc Double sided panel: mainly used for electronic industry instruments, communication equipment, etc
 PI Stiffener with outer layer adhesive
    PI Stiffener with outer layer adhesive
  • Adhesive Type: Inner Layer：Modified Epoxy resin + Outer Layer: Modified Acrylic resin
  • Dongyi Model: DTIA
  • Application Scenario: FPC Stiffener
  • Introduction: Used for enhancing the insertion and removal of gold fingers and other parts in flexible circuit boards.
 PI Stiffener without outer layer adhesive
    PI Stiffener without outer layer adhesive
  • Adhesive Type: Inner Layer：Modified Epoxy resin
  • Dongyi Model: DTIX
  • Application Scenario: FPC Stiffener
  • Introduction: Used for enhancing the insertion and removal of gold fingers and other parts in flexible circuit boards.
 High Thermal Conductivity Coverlay
    High Thermal Conductivity Coverlay
  • Adhesive Type: Modified Epoxy resin
  • Dongyi Model: DCIS
  • Application Scenario: Car/Medical/Electronic
  • Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
 Low Dk/Df Coverlay
    Low Dk/Df Coverlay
  • Adhesive Type: Modified Polyimide resin
  • Dongyi Model: DCIL
  • Application Scenario: Car/Medical/Electronic
  • Introduction: Low Dk/Df Coverlay is mainly applied in fields with high requirements for signal transmission and environmental stability, such as high-frequency communications,electronic terminals, and automotive electronics.
 Low Dk/Df Coverlay
    Low Dk/Df Coverlay
  • Adhesive Type: Modified Polyimide resin
  • Dongyi Model: DCIL
  • Application Scenario: Car/Medical/Electronic
  • Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
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