High Thermal Conductivity Bonding Sheet-Guangdong Dongyi New Materials Technology Co., Ltd.

Current location: HomeProducts & SolutionsFPC MaterialConsumer ElectronicsHigh Thermal Conductivity Bonding Sheet

- Adhesive Type: Modified Epoxy resin
- Dongyi Model: PS
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet/Multi-layer board
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards

Product Features:

Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards

South China Headquarters
GUANGDONG DONGYI HIGH -TECH MATERIAL SCIENCE&TECHNOLOGY CO., LTD.
[Factory 1] No. 22 Changsheng Road, South District, Zhongshan City, Guangdong Province
[Factory 2] No.1 Zhichuang Road, Banfu Town, Zhongshan City, Guangdong Province
Phone: 0760-88892634 0760-88895714
East China Branch
JIANGSU JUTEK ADVANCED MATERIAL SCIENCE & TECHNOLOGY CO., LTD.(Be wholly-owned subsidiary by Guangdong Dongyi)
Address: Building 3, No. 255 Renmin Middle Road, Chongchuan District, Nantong City, Jiangsu Province
Phone: 0513-80979666
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