PI Coverlay with Thermal Conductivity
    PI Coverlay with Thermal Conductivity
  • Adhesive Type:
  • Dongyi Model: DCIS
  • Application Scenario: Car/Medical/Electronic
  • Introduction: It is applied in electronic/electrical equipment requiring temperature control, new energy, and industrial scenarios, and serves as a key material for enhancing equipment stability.
Halogen Free Black PI Coverlay
    Halogen Free Black PI Coverlay
  • Adhesive Type:
  • Dongyi Model: DCBB
  • Application Scenario: Car/Medical/Electronic
  • Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
Halogen Free Yellow PI Based Coverlay Coated with White Ink
    Halogen Free Yellow PI Based Coverlay Coated with White Ink
  • Adhesive Type:
  • Dongyi Model: DCWB
  • Application Scenario: Car/Medical/Electronic
  • Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
Halogen Free Yellow & Black PI Based Coverlay with Epoxy Adhesive
    Halogen Free Yellow & Black PI Based Coverlay with Epoxy Adhesive
  • Adhesive Type:
  • Dongyi Model: DCIB
  • Application Scenario: Car/Medical/Electronic
  • Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
Halogen-free Acrylic Coverlay
    Halogen-free Acrylic Coverlay
  • Adhesive Type:
  • Dongyi Model: DCIA
  • Application Scenario: Car/Medical/Electronic
  • Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
COG/COB Encapsulation Film
    COG/COB Encapsulation Film
  • Adhesive Type: Modified Acrylic resin
  • Dongyi Model: DOEA
  • Application Scenario: Used for front packaging of COG/COB Display Mini LED projects.
  • Introduction: Used for front packaging of COG/COB Display Mini LED projects.
Thermal Initiation Adhesive
    Thermal Initiation Adhesive
  • Adhesive Type: Modified Acrylic resin
  • Dongyi Model: DLEH
  • Application Scenario: Used for protecting grinding processes such as ceramics, peeling, and wafers.
  • Introduction: Used for protecting grinding processes such as ceramics, peeling, and wafers.
AB Double-sided tape
    AB Double-sided tape
  • Adhesive Type: Modified Acrylic resin
  • Dongyi Model: DUAD
  • Application Scenario: Used for touch screen tempered film, backlight, LCD display screen, flexible circuit board, label, photovoltaic and other fields.
  • Introduction: Used for touch screen tempered film, backlight, LCD display screen, flexible circuit board, label, photovoltaic and other fields.
Anti-Spattering Film (ASF)
    Anti-Spattering Film (ASF)
  • Adhesive Type: Modified Acrylic resin
  • Dongyi Model: DIHA/DSHA
  • Application Scenario: Used for glass touch screens, mobile phone glass back covers, car navigation, etc., to prevent splashing when glass breaks and reduce personal injury.
  • Introduction: Used for glass touch screens, mobile phone glass back covers, car navigation, etc., to prevent splashing when glass breaks and reduce personal injury.