lon-Migration Resistant Bonding Sheet
    lon-Migration Resistant Bonding Sheet
  • Adhesive Type:
  • Dongyi Model: PM-M
  • Application Scenario: reliability-such as flexible printed circuit boards (FPCBs)and new energy BMS battery systems--it prevents short circuits or signal attenuation caused by ion migration and extends the service life of products.
  • Introduction: In electronic and industrial fields that have extremely high requirements for circuit protection, environmental safety.
 Transparent Bonding Sheet
    Transparent Bonding Sheet
  • Adhesive Type:
  • Dongyi Model: P-T
  • Application Scenario: Its application fields are very extensive, with the core focus on products that have requirements for light transmittance.
  • Introduction: Its application fields are very extensive, with the core focus on products that have requirements for light transmittance.
 Low Dk/Df Bonding Sheet
    Low Dk/Df Bonding Sheet
  • Adhesive Type:
  • Dongyi Model: PL
  • Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
  • Introduction: It is mainly used in the manufacturing of electronic components and circuit boards, such as: inner-layer lamination of multi-layer boards, bonding of media with high anti-pollution requirements, and applications for high-frequency series products.
 PH Modified Solvent Based Bonding Sheet
    PH Modified Solvent Based Bonding Sheet
  • Adhesive Type:
  • Dongyi Model: PH
  • Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
  • Introduction: It is mainly used in the manufacturing of electronic components and circuit boards, such as: inner-layer lamination of multi-layer boards, lamination of rigid-flex boards, chip packaging, etc.
 Halogen Free Epoxy Bonding Sheet
    Halogen Free Epoxy Bonding Sheet
  • Adhesive Type:
  • Dongyi Model: PE
  • Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
  • Introduction: It is mainly used in the manufacturing of electronic components and circuit boards, such as: inner-layer lamination of multi-layer boards, lamination of rigid-flex boards, chip packaging, etc.
 Halogen Free Modified Acrylic Bonding Sheet
    Halogen Free Modified Acrylic Bonding Sheet
  • Adhesive Type: A0/A1
  • Dongyi Model: PA
  • Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
  • Introduction: The product is served as a complementary product for flexible copperclad laminate,its functions include surface and heat insulation.
 High Tg Coverlay
    High Tg Coverlay
  • Adhesive Type:
  • Dongyi Model: DCIH
  • Application Scenario: Car/Medical/Electronic
  • Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
 Halogen Free Double Sided Epoxy Coverlay
    Halogen Free Double Sided Epoxy Coverlay
  • Adhesive Type:
  • Dongyi Model: DCWB
  • Application Scenario: Car/Medical/Electronic
  • Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
 Halogen Free lon-migration ResistantEpoxy Coverlay
    Halogen Free lon-migration ResistantEpoxy Coverlay
  • Adhesive Type:
  • Dongyi Model: DCIB(CAF)
  • Application Scenario: Car/Medical/Electronic
  • Introduction: The product is mainly used as a protective film for notebookbattery and a protective film for FPCB and etc.
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