Product Features:

用于玻璃切割、晶圆片切割、镜头芯片切割保护,具有极高的初期粘结强度,UV照射后瞬间失粘,易剥离。

Product Structure:

Application Scenario:

  • Product Parameters:

    • Product Description
    • Glue Type
    • Dongyi Model
    • Adhesive Thickness
    • PI Thickness
    • Copper Foil Type
    • Copper Thickness

    Data Download: