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UV Initiation Adhesive
- Adhesive Type: Modified Acrylic resin
- Dongyi Model: DLEUV
- Application Scenario: Used for glass cutting, wafer cutting, and lens chip cutting protection, it has extremely high initial bonding strength and instantly loses adhesion after UV irradiation, making it easy to peel off.
- Introduction: Used for glass cutting, wafer cutting, and lens chip cutting protection, it has extremely high initial bonding strength and instantly loses adhesion after UV irradiation, making it easy to peel off.
Product Features:
Used for glass cutting, wafer cutting, and lens chip cutting protection, it has extremely high initial bonding strength and instantly loses adhesion after UV irradiation, making it easy to peel off.
Product Structure:
Application Scenario:
Electronics
Camera
Light Bar
Product Parameters:
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South China Headquarters
GUANGDONG DONGYI HIGH -TECH MATERIAL SCIENCE&TECHNOLOGY CO., LTD.
[Factory 1] No. 22 Changsheng Road, South District, Zhongshan City, Guangdong Province
[Factory 2] No.1 Zhichuang Road, Banfu Town, Zhongshan City, Guangdong Province
Phone: 0760-88892634 0760-88895714
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East China Branch
JIANGSU JUTEK ADVANCED MATERIAL SCIENCE & TECHNOLOGY CO., LTD.(Be wholly-owned subsidiary by Guangdong Dongyi)
Address: Building 3, No. 255 Renmin Middle Road, Chongchuan District, Nantong City, Jiangsu Province
Phone: 0513-80979666
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