Product Features:

用于各类TP盖板、背光模组、移动电子产品显示屏制程及出货保护。

Product Structure:

Application Scenario:

  • Product Parameters:

    • Product Description
    • Glue Type
    • Dongyi Model
    • Adhesive Thickness
    • PI Thickness
    • Copper Foil Type
    • Copper Thickness

    Data Download: